Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) - ASSID

Offer

Fraunhofer IZM has long-term experience in wafer level packaging and system integration technologies, especially with respect to 3D integration. New wafer level processes are developed and new materials are evaluated and implemented into a complete process integration flow. Upgrading 3D wafer level technologies to 300mm wafer size is the next step in effectively assisting leading companies in meeting the performance, functionality and scaling requirements of their future products. "All Silicon System Integration Dresden" (ASSID) has been established as part of the Fraunhofer IZM Berlin to meet this specific challenge. Our new center has a state-of-the-art clean-room facility and is equipped with a complete 300 mm process line for TSV formation, TSV post-processing on wafer frontside and back-side, 3D device stacking assembly, as well as testing and failure analysis. All these ASSID activities are embedded into the overall Fraunhofer IZM's 3D system integration strategy. ASSID's facilities and know-how are especially tailored to partners in industry for research and development projects, as well as prototype realization. We are also establishing a network for advanced system integration technologies together with other research institutes and universities.

The technical goals will focus on:

* High density TSV with high aspect
* Development of a high speed via filling technologies
* Development of interposer with high density redistribution layer and adopted metallization system for stack formation
* Development of thin wafer handling technologies with adapted bond/ de-bond aproaches
* Wafer level stack formation with thinned bumped devices
* Reliability and yield analysis and modelling for 3D stacks

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