Address
Contact
Tel: 0371 531 24060 Fax: 0371 531 24069 info@zfm.tu-chemnitz.de www.zfm.tu-chemnitz.deContact person
Prof. Dr. Karla HillerOffer
Research focus:
- Development of technologies and components for microsystems (sensors, actuators and arrays)
- Development of ULSI metallization technologies (e. g. copper, copper alloys, barriers, low k materials and patterning
- Development of nanotechnologies, nano components (single electron- Transistors) and ultra-thin functional films (barriers)
The Center for Microtechnologies (ZfM) at Chemnitz University of Technology is the basis for education, research and development in the fields of microelectronics, micromechanics and microsystem technologies. The main research and development activities at ZfM are:- Development of technologies and components for microsystems (sensors, actuators and arrays)
- Development of ULSI metallization technologies (e. g. copper, copper alloys, barriers, low k materials)
- Development of nanotechnologies, nano components and ultra-thin functional films (barriers)
The ZfM facilities include about 1000 m² of cleanrooms (300 m² of class 10 to 100) with equipment for mask and wafer processes. The typical wafer size for Si micromachining is 100 mm and 150 mm for IC metallization. Various joint research projects demonstrate the fruitful co-operation with the Chemnitz department Multi Device Integration of the Fraunhofer Institute for Reliability and Microintegration Berlin.
Technologies:
- Silicon Bulk and Surface Technologies (SCREAM, AIM)
- Ultrathin Functional Films
- Metallization Technologies at Nanometer Scale
- Process and Equipment Simulation Prototypes
- Inclination Sensors
- Acceleration Sensors
- Gyroscopes
- Vibration Sensors
- Micro Mirrors a. o. Services
- Design, Simulation and Modelling
- Mask Design and Preparation
- 100/150mm Silicon Preparation Line
- Packaging
- Test and Characterization (also at wafer scale)
Core Competence: Research Institute
Specializations: Microelectronics (BEOL), Microsystems Technology
Business Fields: Automotive Industry,Semiconductor Industry, Electronics, Communication, Medical Technology, Aerospace
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