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Contact
Tel: 0351 890 2411 Fax: 0351 890 2412 info@accretech.eu www.accretech.jp/english/company/acctgroup/europe/europe_map2.htmlOffer
Sales and service of equipment and devices for microelectronics, precision measuring devices
ACCRETECH is a world-leading equipment supplier to the semiconductor industry. Our key products are Wafer Prober, Dicing
systems, Polish Grinder and Edge Grinder.
Our flagship Wafer Probers, the UF3000EX (pic.1) and UF2000
feature industry-leading accuracy, throughput and reliability. In
2010 we announced three new Prober models including a Frame-
Handling Prober for processing ultra-thin wafers or diced wafers on
frames.
ACCRETECH MAHOH Laser Dicer technology (pic.2) is the
industry leading solution for a completely dry, dust-free cutting
process. The highest quality cut and maximum production volume
are achieved when processing wafers with cutting street widths and
wafer thicknesses down to 15µm.
Our fully-automatic and semi-automatic Twin Spindle Dicers (pic.3)
feature high throughput, flexibility and reliability.
The ACCRETECH Polish Grinder system achieves 200mm and
300mm wafer thickness of 15µm including stress release in the
same system.